Texas Instruments TMS38010JDL Decapped Token Ring Communications Processor Ceramic Gold Lead IC Collectible
Full Description & History
Texas Instruments TMS38010JDL vintage communications processor in a 48-pin ceramic DIP package with gold-colored leads. The ceramic lid has been opened, exposing the original silicon die, bond wires, and internal package construction.
The device is marked TMS38010JDL, WU8748, M-0070838, Philippines. The WU8748 marking is consistent with late-1980s production and a 1987 week-48 date code.
Originally designed as the communications processor for Texas Instruments TMS380 Token Ring LAN adapter architecture.
Lifecycle: OBSOLETE
HISTORICAL BACKGROUND:
The TMS38010 was part of Texas Instruments’ first-generation TMS380 Token Ring chipset developed during the 1980s for IEEE 802.5 local area networking.
The TMS38010 served as the chipset’s Communications Processor and incorporated a high-performance 16-bit CPU, internal communications RAM, timer functions, interrupt handling, and bus-arbitration capability. It worked with devices including the TMS38020 Protocol Handler, TMS38030 System Interface, and TMS38051/TMS38052 Ring Interface components to create a complete Token Ring LAN adapter.
Texas Instruments documentation from the period identifies the TMS38010JDL as a 48-pin ceramic dual-in-line device. These early Token Ring chipsets represent an important period of computer networking history before Ethernet became dominant.
This opened example provides a direct view of the silicon die and internal bonding structure, making it especially suitable for semiconductor collecting, historical display, microscopy, and educational study.
Legacy or discontinued stock no longer in normal production flow. Future supply may be limited.
Pipeline quantities are informational and may change after arrival, inspection, sorting, testing, or donor teardown.
Compatible Radios / Boards
Compatible Radios / Boards
Semiconductor collections
Vintage computer networking collections
Token Ring hardware collections
Texas Instruments semiconductor collections
Decapped IC and exposed-die displays
Microelectronics study
Electronics history displays
Not recommended as a functional replacement because the package has been opened and the die is exposed.
RF Boneyard Bench Notes
RF Boneyard Bench Notes
Not electrically tested. Ceramic package has been intentionally opened, exposing the silicon die and internal bond structure. Sold primarily as a collectible and display specimen.
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